PCB-to-PCB Interconnect Applications



Working in Todays World……

....means that electronic systems are smaller, faster, smarter, and generally far more complex and compact than ever before.  The need for systems to  operate at  multiple frequency levels presents a new set of challenges in  PCB, production and interconnection environments.

Paricon Technologies provides a state of the art family of high performance conductive film, specifically designed for the advanced needs of the electronic industry.

Our unique contact system allows the user to produce board to board connection without the need for dedicated connectors. Because of the PariPoser®  unique topography it is possible to connect to multiple connection formats. The ultra low format of our PariPoser® conductive film allows the user to condense their interconnection requirements, therefore producing a low profile PCB - PCB interconnect solution.

PariPoser® Conductive Film, Connection Technology in a Connected World

Features and Benefits Markets Applications
  • High Bandwidth (>70GHz)
  • Low Profile (<0.4mm)
  • Fine Pitch (<0.2mm)
  • Low Loss (<0.3dB@40GHz)
  • High density
  • Mixed Signalling
  • Low Contact Resistance
  • Low profile
  • Solderless compression mount.
  • Cost Effective
  • Telecom
  • Computer
  • Instrumentation
  • Medical
  • Automotive
  • Military
  • Space
  • Board to Board
  • Memory
  • Processor
  • Test Fixtures
  • Burn-in Sockets
  • Military Equipment
  • Ground and Flight Space Application