Working in Todays World……

....means that electronic systems are smaller, faster, smarter, and generally far more complex and compact than ever before.  The requirement for the next generation systems to be more condensed and compact is now greater than ever presenting new challenges in  PCB interconnection solutions.

Paricon Technologies provides a state of the art high performance conductive film, specifically designed for the advanced needs of the electronic industry.

Soldering a device to the PCB can create challanges for maintenance, rework, and yield.  Paricon High Performance Interposer products provide the solution by mechanically compressing the device through the interposer to the PCB.  The interposer contact greatly increases conductivity through the contact pads and reduces failures due to shock, vibration and thermal thermal cycling commonly occurring in device application.  This is particularly relevant for larger devices with significant I/O count.   

By using a Paricon Interposer, true system cost may be greatly reduced.

Features and benefits Markets Applications
  • High Bandwidth (>70GHz)
  • Low Profile (<0.4mm)
  • Fine Pitch (<0.2mm)
  • Low Loss (<0.3dB@40GHz)
  • Solderless compression mount.
  • Cost Effective


  • Telecom
  • Computer
  • Instrumentation
  • Medical
  • Automotive
  • Military
  • Space
  • Board to Board
  • Memory
  • Processor
  • Test Fixtures
  • Militayr Equipment
  • Ground and Flight Space Application