PariPoser®

PCB to PCB Stacking

Technology

 

 

Working in Todays World……

....means that electronic systems are smaller, faster, smarter, and generally far more complex and compact than ever before.  The requirement for the next generation systems to be more condensed and compact is now greater than ever presenting new challenges in  PCB interconnection solutions.

Paricon Technologies provides a state of the art high performance conductive film, specifically designed for the advanced needs of the electronic industry.

Our unique contact system allows the user to produce PCB stacking systems by using an interconnection profile dedicated to the spacial availability of the overall system. Because of the PariPoser®  unique topography it is possible to connect to multiple connection formats. The ultra low format of our PariPoser® conductive film allows the user to condense their interconnection requirements, therefore producing a low profile PCB - PCB interconnect stacking solution.

PariPoser® Conductive Film, Connection Technology in a Connected World

 
Features and benefits Markets Applications
  • High Bandwidth (>70GHz)
  • Low Profile (<0.4mm)
  • Fine Pitch (<0.2mm)
  • Low Loss (<0.3dB@40GHz)
  • High density
  • Mixed Signalling
  • Low Contact Resistance
  • Low profile
  • Solderless compression mount.
  • Cost Effective

 

  • Telecom
  • Computer
  • Instrumentation
  • Medical
  • Automotive
  • Military
  • Space
  • PCB to PCB Stacking