To achieve optimum performance with PariPoser® materials, it is important to understand their structure and to provide the correct mechanical interface. Paricon’s studies have shown that when the design rules are followed, very high performance electrical interconnection capability can be obtained for a wide range of applications including test, burn-in and production interconnection products.
The PariPoser® fabric is comprised of columns of silver-plated nickel partcles uniformly distributed in a thin sheet of silicone. Typical sheet thickness ranges from 0.0025” to 0.015”. When the PariPoser fabric is compressed between a pair of flat conductors the silicone elastically moves allowing the columns to electrically interconnect the conductors. The contact loading force is generated by the elastic displacement of the silicone. Paricon markets these products under the name “BallWire® contact”. Unlike wire based elastomeric products, BallWire contacts are not easily damaged by excessive loading and are not subject to Euler Column failure. The nickel particles are very hard and are very effective at penetrating oxide layers.
The column density is such that multiple columns will contact each interconnection pad. The PariPoser column density is much greater than the contact spacing. Multiple BallWire™ columns will be present at each pad location. As a result, no orientation of the material, relative to the pads, is required. One just has to make sure that the components being interconnected are aligned to each other.
PariPoser films do not compress under load but move elastically allowing the contact pads to make intimate contact with the BallWire columns. Space must be provided for the silicone to move into. This space is provided by the PariPoser surface roughness and the interstitial space between the contact pads. When a PariPoser connector is compressed between an LGA device and board, the PariPoser film conforms to the surface tending to fill all the voids providing a stable, gasket like interconnection. Little additional vertical motion will occur with load or time. The result is a very stable, environmentally protected interconnection.