PariPoser® Interconnect Technology

To achieve optimum performance with PariPoser® materials, it is important to understand their structure and to provide the correct mechanical interface. Paricon’s studies have shown that when the design rules are followed, very high performance electrical interconnection capability can be obtained for a wide range of applications including test, burn-in and production interconnection products.

The PariPoser® fabric is comprised of columns of silver-plated nickel partcles uniformly distributed in a thin sheet of silicone. Typical sheet   thickness ranges from 0.0025” to 0.015”. When the PariPoser fabric is   compressed between a pair of flat conductors the silicone elastically moves allowing the columns to  electrically  interconnect the conductors. The contact   loading force is generated by the elastic displacement of the silicone. Paricon markets these products under the name “BallWire®  contact”. Unlike wire based elastomeric products, BallWire contacts are not easily damaged by excessive loading and are not subject to Euler Column failure. The nickel particles are very hard and are very effective at penetrating oxide layers.

The column density is such that multiple columns will contact each interconnection pad. The PariPoser  column density is much greater than the contact spacing. Multiple BallWire™ columns will be present at each pad location. As a result, no orientation of the material, relative to the pads, is required. One just has to make sure that the components being interconnected are aligned to each other.

PariPoser films do not compress under load but move elastically allowing the contact pads to make intimate contact with the BallWire columns. Space must be provided for the silicone to move into. This space is provided by the PariPoser surface roughness and the interstitial space between the contact pads. When a PariPoser connector is compressed between an LGA device and board, the PariPoser film conforms to the surface tending to fill all the voids providing a stable, gasket like interconnection. Little additional vertical motion will occur with load or time. The result is a very stable, environmentally protected interconnection.



 


 

Pitch

1.27mm

1.0mm

0.8mm

0.65mm

0.5mm

0.4mm

0.3mm

0.2mm

0.1mm

Construction

Ni/Ag

Silicone Sheet

Ni/Ag

Silicone Sheet

Ni/Ag

Silicone Sheet

Ni/Ag

Silicone Sheet

Ni/Ag

Silicone Sheet

Ni/Ag

Silicone Sheet

Ni/Ag

Silicone Sheet

Ni/Ag

Silicone Sheet

Ni/Ag

Silicone Sheet

Thickness

0.38mm

0.25mm

0.23mm

0.17mm

0.14mm

0.11mm

0.09mm

0.06mm

0.05mm

Combined Min Pad Height   (3)

0.075mm

0.075mm

0.075mm

0.075mm

0.05mm

0.05mm

0.05mm

0.05mm

0.035mm

Pad Diameter

0.762mm

0.6mm

0.48mm

0.39mm

0.3mm

0.24mm

0.18mm

0.12mm

0.06mm

Pad Gap (4)

0.51mm

0.4mm

0.32mm

0.26mm

0.20mm

0.16mm

0.12mm

0.08mm

0.04mm

Pad  Loading   (g/contact)    (5)

80.6

50

32

21.1

12.5

8

4.5

2

0.5

Temperature Range

-50C to 210C

-50C to 210C

-50C to 210C

-50C to 210C

-50C to 210C

-50C to 210C

-50C to 210C

-50C to 210C

-50C to 210C

Normalized Thermal

Conductivity (7,8)

1300W/m2

2000W/m2

2200W/m2

2900W/m2

3600W/m2

4500W/m2

5600W/m2

8300/m2

10000W/m2

Current: Amp/0.5mm2 /pad (6)

40

20 15 12 8 6 2 1 1/4

Breakdown Voltage

Exceeds breakdown voltages of printed Circuit Board

RF Loss at

40Ghz

<1.0dB

<0.6dB

<0.5dB

<0.4dB

<0.3dB

<0.3dB

<0.2dB

<0.1dB

<0.05dB

Out Gassing

(CVCM)

0.07%

0.07%

0.07%

0.07%

0.07%

0.07%

0.07%

0.07%

0.07%

Please note:

  1. Data provided is for guidance only
  2. Performance may vary in application
  3. Pad Height includes total height of opposing pads
  4. Gap applies to pads on both sides
  5. Recommended Pad loading has determination factors subject to application
  6. Single Pad @ 20ºC
  7. Bulk Thermal Conductivity is 0.5 watts/(mK°)
  8.  Bulk Thermal Conductivity normalized to sheet thickness